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SST12LP19E Arkusz danych(PDF) 19 Page - Microchip Technology |
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SST12LP19E Arkusz danych(HTML) 19 Page - Microchip Technology |
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19 / 23 page ![]() ©2013 Silicon Storage Technology, Inc. DS70005041C 05/13 19 2.4 GHz High-Power, High-Gain Power Amplifier SST12LP19E Data Sheet Packaging Diagrams Figure 19:8-Contact Extremely-thin Quad Small Outline No-lead (XSON) SST Package Code: QX8 TOP VIEW BOTTOM VIEW SIDE VIEW 0.50 0.41 0.08 Pin # 1 2.00 ±0.10 Pin #1 (laser engraved see note 2) 2.00 ±0.10 0.40 BSC 0.3 0.2 8-xson-2x2-QX8-4.0 1mm 0.05 Max 0.75 See notes 3 and 4 1.60 Note: 1. Similar to JEDEC JEP95 XQFN/XSON variants, though number of contacts and some dimensions are different. 2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown. 3. From the bottom view, the pin #1 indicator may be either a curved indent or a 45-degree chamfer. 4. The external paddle is electrically connected to the die back-side and to VSS. This paddle must be soldered to the PC board; it is required to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device. 5 Untoleranced dimensions are nominal target dimensions. 6. All linear dimensions are in millimeters (max/min). 1.55 |
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