SMA6T30AY datasheet(7/11 Pages) STMICROELECTRONICS

7 / 11 page

SMA6TY

Characteristics

Doc ID 17869 Rev 3

7/11

Figure 10.

Junction capacitance versus reverse

applied voltage for unidirectional

types (typical values)

Figure 11.

Junction capacitance versus

reverse applied voltage for

bidirectional types (typical values)

C(pF)

100

1000

10000

100

1000

F=1 MHz

VOSC=30 mVRMS

Tj=25 °C

SMA6T6V7AY

SMA6T30AY

SMA6T82AY

V (V)

C(pF)

100

1000

10000

100

1000

F=1 MHz

VOSC=30 mVRMS

Tj=25 °C

SMA6T6V7CAY

SMA6T30CAY

SMA6T82CAY

V (V)

Figure 12.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 13.

Thermal resistance junction to

ambient versus copper surface

under each lead

Zth (j-a)/Rth (j-a)

0.01

0.10

1.00

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Printed circuit board FR4,

copper surface = 1 cm2

th(j-a) (°C/W)

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

printed circuit board FR4,

copper thickness = 35 µm

SCu(cm²)

Figure 14.

Leakage current versus junction

temperature (typical values)

Figure 15.

Peak forward voltage drop versus

peak forward current

(typical values)

I (nA)

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

100

125

150

VR=VRM

VRM > 10 V

VRM ≤ 10 V

T (°C)

FM(A)

1.E-02

1.E-01

1.E+00

1.E+01

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

Tj=25 °C

Tj=125 °C

VFM(V)

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