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Zakładka z wyszukiwarką danych komponentów |
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82563EB Arkusz danych(PDF) 1 Page - Intel Corporation |
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82563EB Arkusz danych(HTML) 1 Page - Intel Corporation |
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1 / 52 page  82563EB/82564EB Gigabit Platform LAN Connect Networking Silicon Datasheet Product Features ■ IEEE 802.3ab compliant — Robust operation over the installed base of Category-5 (Cat-5) twisted pair cabling ■ PICMG 3.1 compliant — Robust operation in backplane over Ethernet applications. ■ Support for cable line lengths greater than 100 m (spec); 123 m physical — Robust end to end connections over various cable lengths ■ Full duplex at 10, 100, or 1000 Mb/s and half duplex at 10 or 100 Mb/s. ■ IEEE 802.3ab Auto-negotiation with Next Page support — Automatic link configuration including speed, duplex, and flow control ■ 10/100 downshift — Automatic link speed adjustment with poor quality cable ■ Automatic MDI crossover — Helps to correct for infrastructure issues ■ Advanced Cable Diagnostics — Improved end-user troubleshooting ■ Kumeran interface — Low pin count, high speed interface to the Intel® 631xESB/632xESB I/O Controller Hub — Allows PHY placement proximity to I/O back panel. ■ 7 LED outputs per port (4 configurable plus 3 dedicated) — Link and Activity indications (10, 100, 1000 Mb/s) on each port ■ Clock supplied to the 631xESB/632xESB — Cost optimized design ■ Full chip power down — Support for lowest power state ■ 100 pin TQFP Package — Smaller footprint and lower power dissipation compared to multi-chip MAC and PHY solutions ■ Operating temperature: 0°C to 60° C (maximum) – heat sink or forced airflow not required — Simple thermal design ■ Power Consumption: < 1.0 Watts per port (silicon power) — Minimize impact of incorporating dual Gigabit instead of Fast Ethernet ■ Leaded and lead-free a 100-pin TQFL with an Exposed-Pad*. Devices that are lead-free are marked with a circled “e3” and have a product code: HYXXXXX a.This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity at <1000 ppm. The Material Declaration Data Sheet, which includes lead impurity levels and the concentration of other Restriction on Hazard- ous Substances (RoHS) -banned materials, is available at: ftp://download.intel.com/design/packtech/material_content_IC_Pack In addition, this device has been tested and conforms to the same parametric specifications as previous versions of the device. For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales representative. 316534-004 Revision 2.9 |
Podobny numer części - 82563EB |
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Podobny opis - 82563EB |
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