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LIS3DSH Arkusz danych(PDF) 51 Page - STMicroelectronics |
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LIS3DSH Arkusz danych(HTML) 51 Page - STMicroelectronics |
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51 / 53 page ![]() LIS3DSH Package information Doc ID 022405 Rev 1 51/53 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 12. LGA-16: mechanical data and package dimensions Dimensions Ref. mm inch Min. Typ. M ax. M in. Typ. M ax. A1 1.000 0.0394 A2 0.7850.0309 A3 0.200 0.0079 D1 2.850 3.000 3.150 0.1122 0.1181 0.1240 E1 2.850 3.000 3.150 0.1122 0.1181 0.1240 L1 1.000 1.060 0.0394 0.0417 L2 2.000 2.060 0.07870.0811 N1 0.500 0.0197 N2 1.000 0.0394 M 0.040 0.100 0.160 0.0016 0.0039 0.0063 P1 0.875 0.0344 P2 1.275 0.0502 T1 0.2900.350 0.410 0.0114 0.0138 0.0161 T2 0.190 0.250 0.310 0.0075 0.0098 0.0122 d 0.150 0.0059 k 0.050 0.0020 LGA-16 (3x3x1.0mm) Land Grid Array Package Outline and 7983231 mechanicaldata |
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