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DM330023-2 Arkusz danych(PDF) 21 Page - Microchip Technology |
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DM330023-2 Arkusz danych(HTML) 21 Page - Microchip Technology |
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21 / 64 page ![]() Getting Started 2009 Microchip Technology Inc. DS70605A-page 15 FIGURE 2-3: dsPICDEM™ MCHV DEVELOPMENT SYSTEM (LEFT SIDE) FIGURE 2-4: dsPICDEM™ MCHV DEVELOPMENT SYSTEM (RIGHT SIDE) 2.3 CONNECTING THE SYSTEM 2.3.1 Power Connections It is recommended that cables used for the power connections should be terminated with blue or red insulated crimp terminals. If crimp terminals are not used, care should be taken to ensure that stray strands of wire do not short to adjacent terminals or the enclosure. If possible, all wires should be stripped and tinned with solder before connecting to the dsPICDEM™ MCHV Development System terminals. CAUTION The user must be aware of the operating procedures outlined below and ensure that they are followed. Failure to do so may result in damage to the system. J1 3-Phase Inverter Bridge Connector Hall Sensors/ QEI Connector |
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