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MCP2003 Arkusz danych(PDF) 16 Page - Microchip Technology |
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MCP2003 Arkusz danych(HTML) 16 Page - Microchip Technology |
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16 / 34 page ![]() MCP2003/4/3A/4A DS22230D-page 16 © 2010-2011 Microchip Technology Inc. 2.5 Thermal Specifications THERMAL CHARACTERISTICS Parameter Symbol Typ Max Units Test Conditions Recovery Temperature θRECOVERY +140 — °C Shutdown Temperature θSHUTDOWN +150 — °C Short Circuit Recovery Time tTHERM 1.5 5.0 ms Thermal Package Resistances Thermal Resistance, 8L-DFN θJA 35.7 — °C/W Thermal Resistance, 8L-PDIP θJA 89.3 — °C/W Thermal Resistance, 8L-SOIC θJA 149.5 — °C/W Note 1: The maximum power dissipation is a function of TJMAX, ΘJA and ambient temperature T A. The maximum allowable power dissipation at an ambient temperature is PD = (TJMAX - TA) ΘJA. If this dissipation is exceeded, the die temperature will rise above 150 °C and the device will go into thermal shutdown. |
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