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NE556 Arkusz danych(PDF) 12 Page - STMicroelectronics |
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NE556 Arkusz danych(HTML) 12 Page - STMicroelectronics |
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12 / 16 page ![]() Package information NE556 - SA556 - SE556 12/16 5.1 DIP14 package information Figure 17. DIP14 package mechanical drawing Note: D and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm. Table 4. DIP14 package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A5.33 0.21 A1 0.38 0.015 A2 2.92 3.30 4.95 0.11 0.13 0.19 b 0.36 0.46 0.56 0.014 0.018 0.022 b2 1.14 1.52 1.78 0.04 0.06 0.07 c 0.20 0.25 0.36 0.007 0.009 0.01 D 18.67 19.05 19.69 0.73 0.75 0.77 E 7.62 7.87 8.26 0.30 0.31 0.32 E1 6.10 6.35 7.11 0.24 0.25 0.28 e2.54 0.10 e1 15.24 0.60 eA 7.62 0.30 eB 10.92 0.43 L 2.92 3.30 3.81 0.11 0.13 0.15 |
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