MCP4361502ESLASHML datasheet(64/80 Pages) MICROCHIP

64 / 80 page

MCP434X/436X

DS22233A-page 64

Figure 8-8 shows possible layout implementations for

an application to support the quad and dual options on

the same PCB.

FIGURE 8-8:

Layout to support Quad and

Dual Devices.

8.4.2.3

PCB Area Requirements

In some applications, PCB area is a criteria for device

selection. Table 8-2 shows the package dimensions

and area for the different package options. The table

also shows the relative area factor compared to the

smallest area. For space critical applications, the QFN

package would be the suggested package.

TABLE 8-2:

PACKAGE FOOTPRINT (1)

8.4.3

RESISTOR TEMPCO

Characterization curves of the resistor temperature

coefficient

(Tempco)

are

shown

Figure 2-8,

Figure 2-19, Figure 2-29, and Figure 2-39.

These curves show that the resistor network is

designed to correct for the change in resistance as

temperature increases. This technique reduces the

end to end change is RAB resistance.

8.4.4

HIGH VOLTAGE TOLERANT PINS

High Voltage support (VIHH) on the Serial Interface pins

supports two features. These are:

• In-Circuit Accommodation of split rail applications

and power supply sync issues

• User configuration of the Non-Volatile EEPROM,

Write Protect, and WiperLock feature

Potentiometers Devices

Rheostat Devices

MCP43X1

MCP42X1

MCP43X2

MCP42X2

Package

Package Footprint

Type

Code

Dimensions

(mm)

TSSOP

5.10

6.40

32.64

2.04

QFN

4.00

16.00

TSSOP

6.60

6.40

42.24

2.64

Note 1: Does not include recommended land

pattern dimensions.

Note:

In many applications, the High Voltage will

only be present at the manufacturing

stage so as to “lock” the Non-Volatile wiper

value (after calibration) and the contents

of the EEPROM. This ensures that since

High Voltage is not present under normal

operating conditions, these values can not

be modified.

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