Zakładka z wyszukiwarką danych komponentów
  Polish  ▼
ALLDATASHEET.PL

X  

OP193FSZ Arkusz danych(PDF) 8 Page - Analog Devices

Numer części OP193FSZ
Szczegółowy opis  Precision, Micropower Operational Amplifiers
PDF  20 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

OP193FSZ Arkusz danych(HTML) 8 Page - Analog Devices

Back Button OP193FSZ Datasheet HTML 4Page - Analog Devices OP193FSZ Datasheet HTML 5Page - Analog Devices OP193FSZ Datasheet HTML 6Page - Analog Devices OP193FSZ Datasheet HTML 7Page - Analog Devices OP193FSZ Datasheet HTML 8Page - Analog Devices OP193FSZ Datasheet HTML 9Page - Analog Devices OP193FSZ Datasheet HTML 10Page - Analog Devices OP193FSZ Datasheet HTML 11Page - Analog Devices OP193FSZ Datasheet HTML 12Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 8 / 20 page
background image
OP193/OP293
Rev. C | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage1
±18 V
Input Voltage1
±18 V
Differential Input Voltage1
±18 V
Output Short-Circuit Duration to GND
Indefinite
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +125°C
Junction Temperature Range
−65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
1
For supply voltages less than ±18 V, the input voltage is limited to the
supply voltage.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA1
θJC
Unit
8-Lead SOIC_N (S)
158
43
°C/W
1
θJA is specified for the worst-case conditions. θJA is specified for a device
soldered in a circuit board for the SOIC package.
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


Arkusz danych Pobierz

Go To PDF Page


Link URL



Czy Alldatasheet okazała się pomocna?  [ DONATE ] 

O Alldatasheet   |   Reklama   |   Kontakt   |   Polityka prywatności   |   Link do karty katalogowej    |   Linki   |   Lista producentów
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com