© 2004 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSAV331 • Rev. 1.0.2

6

Physical Dimensions

0.65

4.4±0.1

MTC16rev4

0.11

4.55

5.00

5.00±0.10

12°

7.35

4.45

1.45

5.90

Figure 8. 16-Lead, Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify

or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically

the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/