LT1129/LT1129-3.3/LT1129-5

14

112935ff

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

Q(DD5) 0502

.028 – .038

(0.711 – 0.965)

TYP

.143

+.012

–.020

()

3.632

+0.305

–0.508

.067

(1.702)

BSC

.013 – .023

(0.330 – 0.584)

.095 – .115

(2.413 – 2.921)

.004

+.008

–.004

()

0.102

+0.203

–0.102

.050 ± .012

(1.270 ± 0.305)

.059

(1.499)

TYP

.045 – .055

(1.143 – 1.397)

.165 – .180

(4.191 – 4.572)

.330 – .370

(8.382 – 9.398)

.060

(1.524)

TYP

.390 – .415

(9.906 – 10.541)

15° TYP

.420

.350

.565

.090

.042

.067

RECOMMENDED SOLDER PAD LAYOUT

.325

.205

.080

.565

.090

RECOMMENDED SOLDER PAD LAYOUT

FOR THICKER SOLDER PASTE APPLICATIONS

.042

.067

.420

.276

.320

NOTE:

1. DIMENSIONS IN INCH/(MILLIMETER)

2. DRAWING NOT TO SCALE

.300

(7.620)

.075

(1.905)

.183

(4.648)

.060

(1.524)

.060

(1.524)

.256

(6.502)

BOTTOM VIEW OF DD PAK

HATCHED AREA IS SOLDER PLATED

COPPER HEAT SINK

Q Package

5-Lead Plastic DD Pak

(LTC DWG # 05-08-1461)