MPC17C724EPSLASHR2 datasheet(9/13 Pages) FREESCALE

9 / 13 page

Analog Integrated Circuit Device Data

Freescale Semiconductor

17C724

TYPICAL APPLICATIONS

FUNCTIONAL TERMINAL DESCRIPTION

TYPICAL APPLICATIONS

Figure 6 shows a typical application for the 17C724.

Figure 6. 17C724 Typical Application Diagram

CEMF SNUBBING TECHNIQUES

Care must be taken to protect the IC from potentially

damaging CEMF spikes induced when commutating currents

in inductive loads. Typical practice is to provide snubbing of

voltage transients by placing a zener or capacitor at the

supply terminal (VM) (see Figure 7).

Figure 7. CEMF Snubbing Techniques

PCB LAYOUT

When designing the printed circuit board (PCB), connect

sufficient capacitance between power supply and ground

terminals to ensure proper filtering from transients. For all

high-current paths, use wide copper traces and shortest

possible distance.

APPLICATION NOTES

Although VM1 and VM2 are connected internally, they

must be connected externally to attain sufficient power

distribution.

Take precautions to guard against electrostatic discharge

when handling the device, especially when mounting and

demounting the device to a PCB.

MCU

17C724

3.0 V

GND

IN1B

IN2A

IN2B

PSAVE

OUT1B

OUT2B

OUT1A

IN1A

OUT2A

VDD

17C724

3.0 V

GND

VDD

OUT

17C724

3.0 V

GND

VDD

OUT

MPC17C724EP/R2 Arkusz danych(PDF) 9 Page - Freescale Semiconductor, Inc

MPC17C724EP/R2 Arkusz danych(HTML) 9 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13

Arkusz danych Pobierz

Link URL