TMP300

SBOS335C – JUNE 2005 – REVISED JANUARY 2011

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

SC70-6

DCK

BPN

TMP300

SOT23-6

DBV

T300

SC70-6

DCK

QWL

TMP300B

SOT23-6

DBV

DUDC

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

Supply Voltage

V+

+18

V

–0.5 to (V+) + 0.5

V

±10

mA

Continuous

Open-Drain Output

(V+) + 0.5

V

Operating Temperature

–40 to +150

°C

Storage Temperature

–55 to +150

°C

Junction Temperature

+150

°C

Human Body Model (HBM)

4000

V

ESD Rating

Charged Device Model (CDM)

1000

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should

be current limited to 10mA or less.

(3)

Short-circuit to ground.

2

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