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MP2249 Arkusz danych(PDF) 2 Page - Monolithic Power Systems |
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MP2249 Arkusz danych(HTML) 2 Page - Monolithic Power Systems |
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2 / 12 page ![]() MP2249 – 6V, 3A, 1MHZ, SYNCHRONOUS STEP-DOWN CONVERTER MP2249 Rev.1.0 www.MonolithicPower.com 2 11/2/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2010 MPS. All Rights Reserved. RDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP2249DN SOIC8E MP2249 MP2249DQT * TQFN10 (3mm x 3mm) AAVY -40°C to +85°C * For Tape and Reel, add suffix -Z (e.g. MP2249DQT–Z). For RoHS Compliant Packaging, add suffix - LF (e.g. MP2249DQT–LF–Z); PACKAGE REFERENCE TQFN10 (3mm x 3mm) SOIC8E ABSOLUTE MAXIMUM RATINGS (1) PVIN to GND ...............................-0.3V to +6.5V SW to GND ............................-0.3V to VIN +0.3V FB, EN & PG to GND...................-0.3V to +6.5V Junction Temperature.............................+150 °C Continuous Power Dissipation (TA = +25°C) (2) SOIC8E...................................................... 2.5W TQFN10 (3mmx3mm) ................................ 2.5W Lead Temperature ..................................+260 °C Storage Temperature .............. -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN .............................2.5V to 6V Output Voltage VOUT...........................0.6V to 6V Operating Junct. Temp. ........... -40 °C to +125°C Thermal Resistance (4) θJA θJC SOIC8E .................................. 50 ...... 10... °C/W TQFN10 (3mmx3mm)............. 50 ...... 12... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature. TJ(MAX) the junction-to- ambient thermal resistance θJA and the ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(MAX)=(TJ(MAX)-TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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