ATS632LSC

HALL-EFFECT

GEAR-TOOTH SENSOR

SUBASSEMBLY

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Sensor Location (in millimeters)

(sensor location relative to package center is the design

objective)

MECHANICAL INFORMATION

† All industry-accepted soldering techniques are permitted for these subassemblies provided the indicated

maximum temperature for each component (e.g., sensor face, plastic housing) is not exceeded. Reasonable

dwell times, which do not cause melting of the plastic housing, should be used.

Component

Material

Function

Units

Package

Polyamide 6/12,

264 psi deflection temp. (DTUL)

200

°C

33% glass filled

Approximate melting temperature

219

°C

Circuit Board

High-temperature FR-4

Glass transition temperature

170

°C

Terminals

1 oz Copper

–

–

Terminal Finish

63/37 tin/lead solder plate

–

†

Flame Class Rating

–

–

UL94V-0

Dwg. MH-021 mm

0.1

A