MP2560DN datasheet(2/19 Pages) MPS

2 / 19 page

MP2560 – 2.5A, 4MHz, 42V STEP-DOWN CONVERTER

MP2560 Rev. 1.2

www.MonolithicPower.com

1/25/2010

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Temperature

MP2560DQ

3x3 QFN10

S8YW

MP2560DN

SOIC8E

MP2560DN

–40

°C to +85°C

* For Tape & Reel, add suffix –Z (eg. MP2560DQ–Z). For RoHS Compliant Packaging, add suffix –LF (eg.

MP2560DQ–LF–Z)

** For Tape & Reel, add suffix –Z (eg. MP2560DN–Z). For RoHS Compliant Packaging, add suffix –LF (eg.

MP2560DN–LF–Z)

PACKAGE REFERENCE

TOP VIEW

COMP

BST

VIN

FREQ

GND

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

COMP

BST

VIN

FREQ

GND

TOP VIEW

EXPOSED PAD

CONNECT TO GND

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VIN).....................–0.3V to +45V

Switch Voltage (VSW) ..........................................

............. –0.3V (-7V for < 10ns) to VIN + 0.3V

BST to SW .....................................–0.3V to +6V

All Other Pins.................................–0.3V to +6V

Continuous Power Dissipation… (TA = +25°C)

(2)

3x3 QFN10 ................................................ 2.5W

SOIC8 ........................................................ 2.5W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature.............. –65°C to +150

°C

Recommended Operating Conditions

(3)

Supply Voltage VIN ...........................4.5V to 42V

Output Voltage VOUT.........................0.8V to 39V

Operating Temperature............. –40

°C to +85°C

Thermal Resistance

(4)

θJA

θJC

3x3 QFN10 ............................. 50 ...... 12...

°C/W

SOIC8 (Exposed Pad) ............ 50 ...... 10...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

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