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Extended Temperature Fusion Devices

AFS600

AFS1500

Cortex-M1Devices

M1AFS600

M1AFS1500

System Gates

600,000

1,500,000

Tiles(D–flip–flops)

13,824

38,400

AES-Protected ISP

Yes

Yes

PLLs

2

2

Globals

18

18

FlashMemoryBlocks(2Mbits)

2

4

TotalFlashMemoryBits

4 M

8 M

FlashROMBits

1,024

1,024

RAMBlocks(4,608bits)

24

60

RAM(kbits)

108

270

Analog Quads

10

10

Analog Input Channels

30

30

Gate Driver Outputs

10

10

I/OBanks(+JTAG)

5

5

Maximum Digital I/Os

172

223

Analog I/Os

40

40

Package Pins

FG

FG256, FG484

FG256, FG484

Extended Temperature Fusion

Mixed signal integration at extended temperatures

Microsemi Fusion mixed signal FPGAs integrate configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry and

high-performance, flash-based reprogrammable logic in a monolithic device. Innovative Fusion architecture can be used with Microsemi’s soft microcontroller (MCU)

core as well as the performance-maximized 32-bit ARM Cortex-M1 cores. Extended temperature Fusion devices operate at temperatures from 100ºC to as low

as -55ºC.

Extended Temperature Fusion Devices