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STM32F415RG Arkusz danych(PDF) 76 Page - STMicroelectronics |
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STM32F415RG Arkusz danych(HTML) 76 Page - STMicroelectronics |
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76 / 186 page ![]() Electrical characteristics STM32F415xx, STM32F417xx 76/186 DocID022063 Rev 4 5.1.6 Power supply scheme Figure 21. Power supply scheme 1. Each power supply pair must be decoupled with filtering ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure the good functionality of the device. 2. To connect BYPASS_REG and PDR_ON pins, refer to Section 2.2.16: Voltage regulator and Table 2.2.15: Power supply supervisor. 3. The two 2.2 µF ceramic capacitors should be replaced by two 100 nF decoupling capacitors when the voltage regulator is OFF. 4. The 4.7 µF ceramic capacitor must be connected to one of the VDD pin. 5. VDDA=VDD and VSSA=VSS. MS19911V2 Backup circuitry (OSC32K,RTC, Wakeup logic Backup registers, backup RAM) Kernel logic (CPU, digital & RAM) Analog: RCs, PLL,.. Power switch VBAT GPIOs OUT IN 15 × 100 nF + 1 × 4.7 μF VBAT = 1.65 to 3.6V Voltage regulator VDDA ADC IO Logic VDD 100 nF + 1 μF Flash memory VCAP_1 VCAP_2 2 × 2.2 μF BYPASS_REG PDR_ON Reset controller VDD 1/2/...14/15 VSS 1/2/...14/15 VDD VREF+ VREF- VSSA VREF 100 nF + 1 μF |
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