STPS2L40AF datasheet(5/10 Pages) STMICROELECTRONICS

5 / 10 page

STPS2L40

Characteristics

5/10

Figure 13.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 14.

Junction capacitance versus

reverse voltage applied (typical

values)

Figure 15.

Forward voltage drop versus

forward current (high level)

Figure 16.

Forward voltage drop versus

forward current (low level)

I (mA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

j=125°C

j=25°C

V (V)

100

1000

100

C(pF)

V (V)

F=1MHz

=30mV

T =25°C

OSC

RMS

0.1

1.0

10.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

(A)

(V)

T =25°C

(maximum values)

T =125°C

(maxmimum values)

T =125°C

(typical values)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

(A)

(V)

T =25°C

(maximum values)

T =125°C

(maxmimum values)

T =125°C

(typical values)

Figure 17.

Thermal resistance junction to

ambient versus copper surface

under each lead, SMB, SMBflat

(epoxy printed board FR4, copper

thickness = 35 µm)

Figure 18.

Thermal resistance junction to

ambient versus copper surface

under each lead, SMAflat (epoxy

printed board FR4, copper

thickness = 35 µm)

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(cm²)

SMB

(°C/W)

th(j-a)

SMBflat

100

120

140

160

180

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMAflat

(cm²)

(°C/W)

th(j-a)

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