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VNQ600AP-E Arkusz danych(PDF) 21 Page - STMicroelectronics |
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VNQ600AP-E Arkusz danych(HTML) 21 Page - STMicroelectronics |
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21 / 26 page ![]() VNQ600AP-E Package and PCB thermal data Doc ID 10873 Rev 4 21/26 Figure 23. Rthj-amb Vs PCB copper area in open box free air condition Figure 24. Thermal impedance junction ambient single pulse 10 20 30 40 50 60 70 01 23 45 67 PCB Cu heatsink area (cm^2)/island RTHj_am b (°C/W) 0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 time(s) Zth(°C/W) 6 cm ^2/is land 3 cm ^2/is land 0,5 cm ^2/is land One channel ON Two channels ON on same chip |
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