MCP201 datasheet(32/40 Pages) MICROCHIP

32 / 40 page

MCP201

DS21730F-page 32

8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]

PUNCH SINGULATED

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

1.27 BSC

Overall Height

–

0.85

1.00

Molded Package Thickness

–

0.65

0.80

Standoff

0.00

0.01

0.05

Base Thickness

0.20 REF

Overall Length

4.92 BSC

Molded Package Length

4.67 BSC

Exposed Pad Length

3.85

4.00

4.15

Overall Width

5.99 BSC

Molded Package Width

5.74 BSC

Exposed Pad Width

2.16

2.31

2.46

Contact Width

0.35

0.40

0.47

Contact Length

0.50

0.60

0.75

Contact-to-Exposed Pad

0.20

–

Model Draft Angle Top

–

12°

NOTE 2

NOTE 1

EXPOSED

PAD

BOTTOM VIEW

TOP VIEW

Microchip Technology Drawing C04-113B

MCP201 Arkusz danych(PDF) 32 Page - Microchip Technology

MCP201 Arkusz danych(HTML) 32 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Arkusz danych Pobierz

Link URL