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CMPWR160SA Arkusz danych(PDF) 9 Page - California Micro Devices Corp

Numer części CMPWR160SA
Szczegółowy opis  USB peripheral Power Management
PDF  10 Pages
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Producent  CALMIRCO [California Micro Devices Corp]
Strona internetowa  http://www.calmicro.com
Logo CALMIRCO - California Micro Devices Corp

CMPWR160SA Arkusz danych(HTML) 9 Page - California Micro Devices Corp

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CALIFORNIA MICRO DEVICES
©2000 California Micro Devices Corp. All rights reserved. SmartOR™ is a trademark of California Micro Devices Corporation.
12/5/2000
9
215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
CMPWR160
Typical Thermal Characteristics
Thermal dissipation of junction heat consists primarily of
two paths in series. The first path is the junction to the
case (
θ
JC) thermal resistance which is defined by the
package style, and the second path is the case to
ambient (
θ
CA) thermal resistance, which is dependent on
board layout.
The overall junction to ambient (
θ
JA) thermal resistance is
equal to:
θ
JA = θJC + θCA
For a given package style and board layout, the operat-
ing junction temperature is a function of junction power
dissipation P
JUNC, and the ambient temperature, resulting
in the following thermal equation:
T
JUNC = TAMB + PJUNC JC ) + PJUNC CA )
= T
AMB + PJUNC JA)
The CMPWR160SA is housed in a thermally enhanced
package where all the GND pins (5 through 8) are
integral to the leadframe (fused leadframe). When the
device is mounted on a double sided printed circuit
board with two square inches of copper allocated for
“heat spreading”, the resulting
θ
JA is 50°C/W.
Based on a maximum power dissipation of
1.0W (2Vx500mA) with an ambient of 70°C the resulting
junction temperature will be:
T
JUNC = TAMB + PJUNC JA )
= 70°C + 1.0W (50°C/W)
= 70°C + 50°C = 120°C
All thermal characteristics of the CMPWR160SA were
measured using a double sided board with two square
inches of copper area connected to the GND pins for
“heat spreading”.
Measurements showing performance up to junction
temperature of 125°C were performed under light load
conditions (5mA). This allows the ambient temperature to
be representative of the internal junction temperature.
Note: The use of multi-layer board construction with
power planes will further enhance the thermal perfor-
mance of the package. In the event of no copper area
being dedicated for heat spreading, a multi-layer board
construction, using only the minimum size pad layout,
will typically provide the CMPWR160SA with an overall
θ
JA of 70°C/W which allows up to 780mW to be safely
dissipated.
Output Voltage vs.Temperature
Figure 14 shows the regulator V
OUT performance up to
the maximum rated junction temperature. A 125°C
variation in junction temperature from –25°C causes an
output voltage variation of about 50mV, reflecting
a voltage temperature coefficient of approximately
±50ppm/°C.
Figure 14. V
OUT Temperature Variation (5mA)
3.35
3.25
3.27
3.29
3.31
3.33
–25
25
075
Temperature (˚C)
50
100
125



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