CS8271 datasheet(6/6 Pages) CHERRY

6 / 6 page

Thermal Data

SOIC

PDIP

RQJC

typ

ûC/W

RQJA

typ

165

100

ûC/W

Lead Count

Metric

English

Max

Min

Max

Min

8L SOIC

5.00

4.80

.197

.189

8L PDIP

10.16

9.02

.400

.355

Rev. 3/26/97

Part Number

Description

CS8271YD8

8L SOIC

CS8271YDR8

8L SOIC (tape & reel)

CS8271YN8

8L PDIP

Package Specification

Ordering Information

PACKAGE DIMENSIONS IN mm (INCHES)

PACKAGE THERMAL DATA

Cherry Semiconductor Corporation reserves the

right to make changes to the specifications without

notice. Please contact Cherry Semiconductor

Corporation for the latest available information.

Surface Mount Narrow Body (D); 150 mil wide

Plastic DIP (N); 300 mil wide

0.39 (.015)

MIN.

2.54 (.100) BSC

1.77 (.070)

1.14 (.045)

Some 8 and 16 lead

packages may have

1/2 lead at the end

of the package.

All specs are the same.

.203 (.008)

.356 (.014)

REF: JEDEC MS-001

3.68 (.145)

2.92 (.115)

8.26 (.325)

7.62 (.300)

7.11 (.280)

6.10 (.240)

.356 (.014)

.558 (.022)

1.27 (.050) BSC

0.51 (.020)

0.33 (.013)

6.20 (.244)

5.80 (.228)

4.00 (.157)

3.80 (.150)

1.57 (.062)

1.37 (.054)

0.25 (0.10)

0.10 (.004)

1.75 (.069) MAX

1.27 (.050)

0.40 (.016)

REF: JEDEC MS-012

0.25 (.010)

0.19 (.008)

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