| Zakładka z wyszukiwarką danych komponentów |
|
L6208PD Arkusz danych(PDF) 28 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
L6208PD Arkusz danych(HTML) 28 Page - STMicroelectronics |
|
28 / 35 page ![]() Application information L6208 28/35 DocID7514 Rev 2 Figure 31. PowerDIP24 junction ambient thermal resistance versus on-board copper area Figure 32. SO24 junction ambient thermal resistance versus on-board copper area Figure 33. Mounting the PowerSO package Slug soldered to PCB with dissipating area Slug soldered to PCB with dissipating area plus ground layer Slug soldered to PCB with dissipating area plus ground layer contacted through via holes |
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |