SM4TY

Characteristics

Doc ID 17862 Rev 3

5/12

Figure 11.

Peak forward voltage drop versus peak forward current (typical values)

Figure 9.

Thermal resistance junction to

ambient versus copper surface

under each lead

Figure 10.

Leakage current versus junction

temperature (typical values)

0

10

20

30

40

50

60

70

80

90

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S (cm²)

Cu

Printed circuit board FR4,

copper thickness = 35 µm

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

25

50

75

100

125

150

I (nA)

R

T (°C)

j

V= V

V10 V

RRM

V= V

V

< 10 V

RRM

RM

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

T = 125 °C

j

I (A)

FM

T = 25 °C

j

V

(V)

FM