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80960KB Arkusz danych(PDF) 35 Page - Intel Corporation

Numer części 80960KB
Szczegółowy opis  EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT
PDF  44 Pages
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Producent  INTEL [Intel Corporation]
Strona internetowa  http://www.intel.com
Logo INTEL - Intel Corporation

80960KB Arkusz danych(HTML) 35 Page - Intel Corporation

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80960KB
3.3
Package Thermal Specification
The 80960KB is specified for operation when case
temperature is within the range 0°C to 85°C (PGA)
or 0°C to 100°C (PQFP). Measure case temperature
at the top center of the package. Ambient temper-
ature can be calculated from:
TJ = TC + P*θjc
TA = TJ + P*θja
TC = TA + P*[θja−θjc]
Values for θja and θjc for various airflows are given in
Table 12 for the PGA package and in Table 12 for
the PQFP package. The PGA’s θja can be reduced
by adding a heatsink. For the PQFP, however, a
heatsink is not generally used since the device is
intended to be surface mounted.
Maximum allowable ambient temperature (TA)
permitted without exceeding TC is shown by the
graphs in Figures 23, 24, 25 and 26. The curves
assume the maximum permitted supply current (ICC)
at each speed, VCC of +5.0 V and a TCASE of +85°C
(PGA) or +100°C (PQFP).
If the 80960KB is to be used in a harsh environment
where the ambient temperature may exceed the
limits for the normal commercial part, consider using
an
extended
temperature
device.
These
components are available at 16, 20 and 25 MHz in
the ceramic PGA package. Extended operating
temperature range is –40° C to +125°C (case).
Figure 26 shows the maximum allowable ambient
temperature for the 20 MHz extended temperature
TA80960KB at various airflows. The curve assumes
an ICC of 420 mA, VCC of 5.0 V and a TCASE of
+125°C.
Table 14. 80960KB PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
50
(0.25)
100
(0.50)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
θ Junction-to-Case
2
2
2
2
2
2
2
θ Case-to-Ambient
(No Heatsink)
19
18
17
15
12
10
9
θ Case-to-Ambient
(Omnidirectional
Heatsink)
16
15
14
12
9
7
6
θ Case-to-Ambient
(Unidirectional Heat-
sink)
15
14
13
11
8
6
5
NOTES:
1. This table applies to 80960KB PGA plugged into socket or soldered directly to board.
2. θJA = θJC + θCA
3. θJ-CAP = 4°C/W (approx.)
θJ-PIN = 4°C/W (inner pins) (approx.)
θJ-PIN = 8°C/W (outer pins) (approx.)
θJC
θJA
θJ-PIN
θJ-CAP



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