MML20211HT1

19

RF Device Data

Freescale Semiconductor

PRODUCT DOCUMENTATION, TOOLS AND SOFTWARE

Refer to the following resources to aid your design process.

Application Notes

 AN1955: Thermal Measurement Methodology of RF Power Amplifiers

Software

 .s2p File

Development Tools

 Printed Circuit Boards

For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to

Software & Tools on the part’s Product Summary page to download the respective tool.

FAILURE ANALYSIS

At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In

cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third

party vendors with moderate success. For updates contact your local Freescale Sales Office.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

Aug. 2011

 Initial Release of Data Sheet

1

Sept. 2014

 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test

results of the device, p. 1

 Table 6, ESD Protection Characteristics: removed the word “Minimum” after the ESD class rating. ESD

ratings are characterized during new product development but are not 100% tested during production. ESD

ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive

devices, p. 2

 Revised Failure Analysis information, p. 19