1-113

°C)

Parameter

Symbol

Min.

Max.

Units

Storage Temperature

-55

125

°C

Operating Temperature

-40

85

°C

Average Forward Input Current

20

mA

Peak Forward Input Current

40

mA

(50% Duty Cycle, 1 ms Pulse Width)

Reverse Input Voltage (Each Channel)

5V

Input Power Dissipation (Each Channel)

35

mW

Output Current (Each Channel)

60

mA

Supply Voltage and Output Voltage

-0.5

18

V

(HCPL-2731, HCPL-0731)

Supply Voltage and Output Voltage

-0.5

7

V

(HCPL-2730, HCPL-0730)

Output Power Dissipation (Each Channel) -Note 12

100

mW

Total Power Dissipation (Each Channel)

135

mW

Lead Solder Temperature (for Through Hole Devices)

260

°C for 10 sec., 1.6 mm below seating plane

Reflow Temperature Profile

See Package Outline Drawings section

(for SOIC-8 and Option #300)

Insulation Related Specifications (HCPL-2731/2730/0731/0730)

8-Pin DIP

(300 Mil)

SO-8

Parameter

Symbol

Value

Value

Units

Conditions

Minimum External Air

L(101)

7.1

4.9

mm

Measured from input terminals to

Gap (External

output terminals, shortest distance

Clearance)

through air.

Minimum External

L(102)

7.4

4.8

mm

Measured from input terminals to

Tracking (External

output terminals, shortest distance

Creepage)

path along body.

Minimum Internal Plastic

0.08

0.08

mm

Through insulation distance, conductor

Gap (Internal Clearance)

to conductor, usually the direct

distance between the photoemitter and

photodetector inside the optocoupler

cavity.

Tracking Resistance

CTI

200

200

Volts

DIN IEC 112/ VDE 0303 Part 1

(Comparative Tracking

Index)

Isolation Group

IIIa

IIIa

Material Group DIN VDE 0110

Option 300 – surface mount classification is Class A in accordance with CECC 00802.