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HCS112MS Arkusz danych(PDF) 9 Page - Intersil Corporation |
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HCS112MS Arkusz danych(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 19 HCS112MS Die Characteristics DIE DIMENSIONS: 89 x 88 mils 2.25 x 2.24mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS112MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS112 is TA14341A. CP1 (1) KA (2) JA (3) SA (4) QA (5) QA (6) QB (7) GND (8) QB (9) SB (10) (11) JB (12) KB (13) CPB (14) RB (15) RA VCC (16) Spec Number 518830 |
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