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HCS138MS Arkusz danych(PDF) 9 Page - Intersil Corporation |
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HCS138MS Arkusz danych(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 151 HCS138MS Die Characteristics DIE DIMENSIONS: 85 x 101 mils METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCS138MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS138 is TA14361A. A1 A0 VCC A2 (3) E1 (4) E2 (5) E3 (6) (8) (9) (10) (11) Y4 (12) Y3 (13) Y2 (14) Y1 (2) (1) (16) GND Y6 Y5 (7) Y0 (15) NC NC Y7 NC NC Spec Number 518751 |
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