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AN3232 Arkusz danych(PDF) 11 Page - STMicroelectronics |
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AN3232 Arkusz danych(HTML) 11 Page - STMicroelectronics |
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11 / 26 page ![]() AN3232 Mounting base surface conditions Doc ID 17594 Rev 3 11/26 5 Mounting base surface conditions The mounting base, or the surface of the core to which the backside of the package is mounted, must be flat, clean, and free of tool marks. Recommended specifications for the surface conditions are shown in Table 2. Flatness and roughness values can be achieved on the above mentioned materials with standard machining processes, such as milling. Improved flatness and lower roughness values reduce both electrical and thermal resistance. Table 2. Surface conditions Flatness Roughness, Ra 400 µin / in (0.4 µm/mm) < 30 µin (0.8 µm) |
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