06.07.2010

XSL-375-5E-R4

3 of 5

directivity:

Device Materials

Item

Material

Encapsulation Silicone Resin

Lead frame

Fe + Ag coating

XSL-375-5E is RoHS compliant

Precaution for Use

1. Cautions

• This device is a UV LED, which radiates intense UV light during operation.

• DO NOT look directly into the UV light or look through the optical system. To prevent

inadequate exposure of UV radiation, wearing UV protective glasses is recommended

2. Lead Forming

• When forming leads, the leads should be bent at a point at least 3 mm from the base of the

lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.

• Lead forming should be done before soldering.

• DO NOT apply any bending stress to the base of the lead. The stress to the base may

damage the LED’s characteristics or it may break the LEDs.

• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should

be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it

causes deterioration of the lead and it will degrade the LEDs.