LM78XX

LINEAR INTEGRATED CIRCUIT

UNISONICTECHNOLOGIESCO.,LTD

10 of 13

www.unisonic.com.tw

QW-R101-006.U



NOTES FOR USE

1. Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual

operating conditions.

2. Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating

conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short

circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider

adding circuit protection devices, such as fuses.

3. GND voltage

The potential of GND pin must be minimum potential in all operating conditions.

4. Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the

IC to malfunction.

5. Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards.

The IC may be damaged if there is any connection error or if pins are shorted together.

6. Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD

circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or

guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment

where the operation of this circuit is assumed.

7. Overcurrent Protection Circuit

An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload

currents.

Continued use of the protection circuits should be avoided. Please note that the current increases negatively

impact the temperature.

8. Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the

IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before

connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly

steps as an antistatic measure. Use similar precaution when transporting or storing the IC.