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MIC2012 Arkusz danych(PDF) 8 Page - Micrel Semiconductor |
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MIC2012 Arkusz danych(HTML) 8 Page - Micrel Semiconductor |
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8 / 10 page ![]() MIC2012 Micrel MIC2012/2072 8 September 2000 Functional Description The MIC2012/2072 are designed to support the power distri- bution requirements for USB wakeup from the ACPI S3 state. It integrates two independent channels under control of input S3#. When S3# is asserted LOW (S3 state) the MIC2012/ 2072 will switch a 500m Ω, 100mA MOSFET switch from the AUX input to each of its two outputs. Conversely when the S3# input is HIGH (S0 state) the MIC2012/72 will switch a 100m Ω, 500mA MOSFET switch from the MAIN input to each of its two outputs. The lower current limit during the ACPI S3 state helps to ensure that the standby supply maintains regulation even during fault conditions. Thermal Shutdown Thermal shutdown is employed to protect the device from damage should the die temperature exceed safe margins due mainly to short circuit faults. Thermal shutdown shuts off the output MOSFET and asserts the FAULT output if the die temperature reaches 140 °C and the overheated channel is in current limit. The other channel is not affected. If, however, the die temperature exceeds 160 °C, both channels will be shut off even if neither channel is in current limit. Power Dissipation The device’s junction temperature depends on several fac- tors such as the load, PCB layout, ambient temperature and package type. The power dissipated in each channel is P D = RDS(on) × IOUT 2 where R DS(on) is the on-resistance of the internal MOSFETs and I OUT is the continuous output current. Total power dissipation of the device will be the summation of P D for both channels. To relate this to junction temperature, the following equation can be used: TJ = P D × θJA + TA where: Functional Diagram Current Limit 10ms Timer Charge Pump + Gate Control S3# EN Current Limit MAIN OUT AUX /FAULT AUX Latch To Other Channel * MAIN FET AUX FET *MIC2070-1/2 Only Thermal Sense * 'P' options only T J = junction temperature T A = ambient temperature θ JA = is the thermal resistance of the package Current Sensing and Limiting The current-limit thresholds are preset internally for each state. The preset level prevents damage to the device and external load but still allows a minimum current of 100mA or 500mA to be delivered to the load depending on the state of the device according to the S3# input. When S3# is LOW the current-limit is set at 100mA minimum. When S3# is HIGH the current-limit is set at 500mA minimum. Should an over-current condition last longer than t DLY, the MIC2072 will latch the faulty output off. The output will remain off until either the load is removed or the EN signal (MIC2072- 1, -2) is toggled. When the MIC2072 enters a latched output condition a 1mA pull-up current source is activated. This provides a way to automatically reset the output once the load is removed without the need to toggle the enable input such as in the MIC2072. Please refer to Figure 7 for timing details. The MIC2012 will automatically reset its output when the die temperature cools down to 120 °C. The MIC2012 output and FAULT signal will continue to cycle on and off until the device is disabled or the fault is removed. Figure 6 depicts typical timing. Depending on PCB layout, package, ambient tem- perature, etc., it may take several hundred milliseconds from the incidence of the fault to the output MOSFET being shut off. This time duration will be shortest in the case of a dead short on the output. |
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