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LP3961 Arkusz danych(PDF) 20 Page - Texas Instruments |
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LP3961 Arkusz danych(HTML) 20 Page - Texas Instruments |
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20 / 31 page ![]() Ground IN OUT SD SENSE Input Capacitor Output Capacitor Pull-up Resistor LP3961, LP3964 SNVS056J – MAY 2000 – REVISED JUNE 2015 www.ti.com Layout Example (continued) Figure 27. LP3964 TO-263 Package Typical Layout 10.3 Heatsinking TO-220 Packages The thermal resistance of a TO-220 package can be reduced by attaching it to a heatsink or a copper plane on a PC board. The heatsink to be used in the application should have a heatsink-to-ambient thermal resistance, RθHA ≤ RθJA − RθCH − RθJC (7) In this equation, RθCH is the thermal resistance from the junction to the surface of the heatsink and RθJC is the thermal resistance from the junction to the surface of the case. 20 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: LP3961 LP3964 |
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