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SIHFP048 Arkusz danych(PDF) 8 Page - Vishay Telefunken

Numer części SIHFP048
Szczegółowy opis  Power MOSFET
PDF  9 Pages
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Producent  TFUNK [Vishay Telefunken]
Strona internetowa  http://www.vishay.com
Logo TFUNK - Vishay Telefunken

SIHFP048 Arkusz danych(HTML) 8 Page - Vishay Telefunken

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Package Information
www.vishay.com
Vishay Siliconix
Revision: 01-Jul-13
1
Document Number: 91360
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TO-247AC (High Voltage)
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Contour of slot optional.
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body.
4. Thermal pad contour optional with dimensions D1 and E1.
5. Lead finish uncontrolled in L1.
6. Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154").
7. Outline conforms to JEDEC outline TO-247 with exception of dimension c.
8. Xian and Mingxin actually photo.
MILLIMETERS
INCHES
MILLIMETERS
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
DIM.
MIN.
MAX.
MIN.
MAX.
A
4.58
5.31
0.180
0.209
D2
0.51
1.30
0.020
0.051
A1
2.21
2.59
0.087
0.102
E
15.29
15.87
0.602
0.625
A2
1.17
2.49
0.046
0.098
E1
13.72
-
0.540
-
b
0.99
1.40
0.039
0.055
e
5.46 BSC
0.215 BSC
b1
0.99
1.35
0.039
0.053
Ø k
0.254
0.010
b2
1.53
2.39
0.060
0.094
L
14.20
16.25
0.559
0.640
b3
1.65
2.37
0.065
0.093
L1
3.71
4.29
0.146
0.169
b4
2.42
3.43
0.095
0.135
N
7.62 BSC
0.300 BSC
b5
2.59
3.38
0.102
0.133
Ø P
3.51
3.66
0.138
0.144
c
0.38
0.86
0.015
0.034
Ø P1
-
7.39
-
0.291
c1
0.38
0.76
0.015
0.030
Q
5.31
5.69
0.209
0.224
D
19.71
20.82
0.776
0.820
R
4.52
5.49
0.178
0.216
D1
13.08
-
0.515
-
S
5.51 BSC
0.217 BSC
ECN: X13-0103-Rev. D, 01-Jul-13
DWG: 5971
0.10
A
C
M
M
E
E/2
(2)
(4)
R/2
B
2 x R
S
D
See view B
2 x e
b4
3 x b
2 x b2
L
C
L1
1
2
3
Q
D
A
A2
A
A
A1
C
Ø k
B
D
M
M
A
ØP
(Datum B)
ØP1
D1
4
E1
0.01
B
D
M
M
View A - A
Thermal pad
D2
DD E
E
C
C
View B
(b1, b3, b5)
Base metal
c1
(b, b2, b4)
Section C - C, D - D, E - E
(c)
Planting
4
3
5
7
4
4
4
Lead Assignments
1. Gate
2. Drain
3. Source
4. Drain



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