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ML4818 Arkusz danych(PDF) 9 Page - Micro Linear Corporation

Numer części ML4818
Szczegółowy opis  Phase Modulation/Soft Switching Controller
PDF  12 Pages
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Producent  MICRO-LINEAR [Micro Linear Corporation]
Strona internetowa  http://www.microlinear.com
Logo MICRO-LINEAR - Micro Linear Corporation

ML4818 Arkusz danych(HTML) 9 Page - Micro Linear Corporation

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ML4818
UNDER-VOLTAGE LOCKOUT
On power up, when VCC is below 16V, the IC draws very
little current (1.1mA typ.) and VREF is disabled. When VCC
rises above 16V, the IC becomes active and VREF is
enabled and will stay in that condition until VCC falls
below 10.2V. (see Figure 12).
INHIBIT
OUTPUTS
+
+
20
24
INTERNAL
BIAS
4V
TO LOGIC
CIRCUITS
5V
VREF
9V
VCC
POWER
DOWN
Figure 12. Under-Voltage Lockout and
Reference Circuits.
Figure 13. Supply Current vs. Temperature (
°C).
70
68
66
64
62
60
58
56
54
52
50
–75
–25
25
75
125
175
TEMPERATURE
Figure 15.
θJA as a Function of I (see figure 15).
50
30
20
0
2
I : HEAT SINK DIMENSION (INCHES)
40
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Figure 14. PC Board Copper Area Used as a Heat Sink.
APPLICATIONS
The application circuit shown in Figure 16 features the
ML4818 in a primary-side controlled voltage mode
application with voltage feed-forward. Input voltage is
rectified 120VAC (nominal). Feed-forward is provided by
the RAMP pin via the resistor connected to the high
voltage input. Current is sensed through sense transformer
T4.
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
0.555"
I
I
I
I
THERMAL INFORMATION
The ML4818 is offered in a Power DIP package. This
package features improved thermal conduction through
the leadframe. Much of the heat is conducted through the
center 4 grounded leads. Thermal dissipation can be
improved with this package by using copper area on the
board to function as a heat sink. Increasing this area can
reduce the
θJA (see figures 14 and 15), increasing the
power handling capability of the package. Additional
improvement may be obtained by using an external heat
sink (available from Staver).



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