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ML4818 Arkusz danych(PDF) 9 Page - Micro Linear Corporation |
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ML4818 Arkusz danych(HTML) 9 Page - Micro Linear Corporation |
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9 / 12 page ![]() 9 ML4818 UNDER-VOLTAGE LOCKOUT On power up, when VCC is below 16V, the IC draws very little current (1.1mA typ.) and VREF is disabled. When VCC rises above 16V, the IC becomes active and VREF is enabled and will stay in that condition until VCC falls below 10.2V. (see Figure 12). INHIBIT OUTPUTS – + + – 20 24 INTERNAL BIAS 4V TO LOGIC CIRCUITS 5V VREF 9V VCC POWER DOWN Figure 12. Under-Voltage Lockout and Reference Circuits. Figure 13. Supply Current vs. Temperature ( °C). 70 68 66 64 62 60 58 56 54 52 50 –75 –25 25 75 125 175 TEMPERATURE Figure 15. θJA as a Function of I (see figure 15). 50 30 20 0 2 I : HEAT SINK DIMENSION (INCHES) 40 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 Figure 14. PC Board Copper Area Used as a Heat Sink. APPLICATIONS The application circuit shown in Figure 16 features the ML4818 in a primary-side controlled voltage mode application with voltage feed-forward. Input voltage is rectified 120VAC (nominal). Feed-forward is provided by the RAMP pin via the resistor connected to the high voltage input. Current is sensed through sense transformer T4. 24 23 22 21 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 9 10 11 12 0.555" I I I I THERMAL INFORMATION The ML4818 is offered in a Power DIP package. This package features improved thermal conduction through the leadframe. Much of the heat is conducted through the center 4 grounded leads. Thermal dissipation can be improved with this package by using copper area on the board to function as a heat sink. Increasing this area can reduce the θJA (see figures 14 and 15), increasing the power handling capability of the package. Additional improvement may be obtained by using an external heat sink (available from Staver). |
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