11

Thermal Characteristics

Units

˚C/W

˚C/W

%/˚C

nm/˚C

Max.

200

300

Min.

Typ.

-0.75

0.45

Symbol

∆

j

Parameter

Thermal Resistance - Infinite Heat Sink

Thermal Resistance - On PCB

Temperature Coefficient - Optical Power

Temperature Coefficient - Wavelength

Optical & Electrical Characteristics (Case Temperature -25 to +70˚C)

Units

dBm

ns

MHz

nm

nm

V

µA

pF

Test Conditions

Max.

2.5

1355

170

1.65

100

Min.

-19

1285

Typ.

2.0

125

1320

135

1.3

200

Symbol

∆

λ

C

Parameter

Fiber-Coupled-Power (Fig 1, 2, 3)

Rise & Fall Time (10-90%, no bias)

Peak Wavelength

Spectral Width (FWHM)

Forward Voltage (Fig 5)

Reverse Current

Capacitance

Note 1: Average power at 10MHz/50% duty cycle. Measured at the exit of 100m of fiber.

Note 2: 62.5/125µm graded index fiber (NA = 0.275).

Note 3: Meets the FDDI ANSI X3T9.5 specification for FDDI.

Absolute Maximum Ratings*

Units

°C

°C

mW

mA

mA

V

°C

Max.

+85

+85

160

80

130

0.5

260

Min.

-40

-40

Symbol

Tstg

Top

Ptot

IF

IFRM

VR

Tsld

Parameter

Storage Temperature

Operating Temperature (Fig 4)

Electrical Power Dissipation (Fig 4)

Continuous Forward Current (f

≤10kHz)

Peak Forward Current (duty cycle

≤50%, f≥1MHz)

Reverse Voltage

Soldering Temperature (Note 1)

*Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.

Note 1: 2mm from the case for 10s.

Datacom, Telecom, General Purpose LED

MF431