RC datasheet(2/3 Pages) VISHAY

2 / 3 page

www.vishay.com

Vishay Techno

Revision: 01-Oct-14

Document Number: 68013

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Note

(1) All dimensions are before solder coating.

Notes

(2) Standard solder plating for the non-magnetic parts are solder terminations E or T. Hot solder dipped terminations F or S are also available.

(3) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring

solderable mounting.

(4) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.

If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then

the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for

solderability and/or solder joint issues.

MECHANICAL SPECIFICATIONS

Resistive element

Ruthenium oxide

Encapsulation

Glass

Substrate

96 % alumina

Termination

Gold, palladium silver, platinum gold,

platinum silver, platinum palladium gold or

solder coated non-magnetic terminations

available.

Solder finish

Base metallization without a solder finish

standard. Hot solder dipped tin/silver or

tin/lead/silver solder alloys available.

ENVIRONMENTAL SPECIFICATIONS

Operating

temperature

-55 °C to +155 °C

Moisture resistance

Less than 0.5 % change when tested

per method 106 of MIL-STD-202

Life

Less than 1 % change when tested

per method 108D (+85 °C)

of MIL-STD-202

Short time overload

Less than 0.5 %

R

DIMENSIONS in inches (millimeters)

MODEL

LENGTH (L) (1)

± 0.006 (0.152)

WIDTH (W) (1)

± 0.006 (0.152)

THICKNESS (T) (1)

± 0.005 (0.127)

RC0540

0.050 (1.27)

0.040 (1.02)

0.020 (0.508)

RC0550

0.050 (1.27)

0.020 (0.508)

RC0575

0.075 (1.90)

0.050 (1.27)

0.020 (0.508)

RC5100

0.100 (2.54)

0.050 (1.27)

0.020 (0.508)

RC1100

0.100 (2.54)

0.020 (0.508)

RC1206

0.125 (3.18)

0.062 (1.57)

0.025 (0.635)

RC5150

0.150 (3.81)

0.050 (1.27)

0.020 (0.508)

RC7225

0.225 (5.72)

0.075 (1.90)

0.020 (0.508)

RC2010

0.200 (5.08)

0.100 (2.54)

0.025 (0.635)

TYPE

TERMINATION

MATERIAL

TERMINATION

STYLE

TERMINATION STYLE/

MATERIAL CODE

SOLDER TERMINATION

CODE

Solderable

Non-magnetic

3-sided (wraparound)

E or T (standard);

F or S (optional) (2)

Top only (flip chip)

Epoxy bondable/



solderable

Platinum palladium gold

3-sided (wraparound)

N (standard);

F or S (optional) (3)

Top only (flip chip)

5-sided (wraparound)

Wire bondable/



Epoxy bondable

Gold

3-sided (wraparound)

Top only (flip chip)

5-sided (wraparound)

Epoxy bondable

Palladium silver (4)

3-sided (wraparound)

Top only (flip chip)

5-sided (wraparound)

Platinum gold

3-sided (wraparound)

Top only (flip chip)

5-sided (wraparound)

Platinum silver

3-sided (wraparound)

Top only (flip chip)

5-sided (wraparound)

Termination Style A



(3-sided wraparound)

0.025 [0.635]

Max.

Termination Style B



(Top conductor only)

0.025 [0.635]

Max.

Termination Style C



(5-sided wraparound)

0.025 [0.635]

Max.

RC Arkusz danych(PDF) 2 Page - Vishay Siliconix

RC Arkusz danych(HTML) 2 Page - Vishay Siliconix

Html Pages

1 2 3

Arkusz danych Pobierz

Link URL