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USB3300 Arkusz danych(PDF) 16 Page - Microchip Technology

Numer części USB3300
Szczegółowy opis  Hi-Speed USB Host, Device or OTG PHY
PDF  53 Pages
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Producent  MICROCHIP [Microchip Technology]
Strona internetowa  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

USB3300 Arkusz danych(HTML) 16 Page - Microchip Technology

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USB3300
DS00001783B-page 16
 2014-2015 Microchip Technology Inc.
6.0
ARCHITECTURE OVERVIEW
The USB3300 architecture can be broken down into the following blocks shown in Figure 6-1, "Simplified USB3300
Architecture" below.
6.1
ULPI Digital
The USB3300 uses the industry standard ULPI digital interface to facilitate communication between the PHY and Link
(device controller). The ULPI interface is designed to reduce the number of pins required to connect a discrete USB
PHY to an ASIC or digital controller. For example, a full UTMI+ Level 3 OTG interface requires 54 signals while a ULPI
interface requires only 12 signals.
The ULPI interface is documented completely in the “UTMI+ Low Pin Interface (ULPI) Specification” document
(www.ulpi.org).
The following sections highlight the key operating modes of the USB3300 digital interface.
6.1.1
OVERVIEW
Figure 6-2 illustrates the block diagram of the ULPI digital functions. It should be noted that this PHY does not use a
“ULPI wrapper” around a UTMI+ PHY core as the ULPI specification implies.
The advantage of a “wrapper less” architecture is that the PHY has a lower USB latency than a design which must first
register signals into the PHY’s wrapper before the transfer to the PHY core. A low latency PHY allows a Link to use a
wrapper around a UTMI Link and still make the required USB turn-around timing given in the USB 2.0 specification.
FIGURE 6-1:
SIMPLIFIED USB3300 ARCHITECTURE
ULPI Digital
OTG
Module
DATA[7:0]
Internal
Regulator &
POR
Bias
Gen.
CLKOUT
NXT
DIR
STP
VDD3.3
XTAL &
PLL
VBUS
ID
VDD3.3
DP
DM
USB3300
RBIAS
HS XCVR
FS/LS
XCVR
Resistors



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