M35B32 datasheet(40/44 Pages) STMICROELECTRONICS

Numer części	M35B32

Szczegółowy opis	32 Kbit, 256-byte page, fast program EEPROM memory accessed by SPI bus interface

PDF	44 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

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40 / 44 page

Package mechanical data

M35B32

40/44

DocID18391 Rev 4

11.3

UFDFN8 package information

Figure 25. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch

dual flat package outline

1. Max. package warpage is 0.05 mm.

2. Exposed copper is not systematic and can appear partially or totally according to the cross section.

3. Drawing is not to scale.

Table 14. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat

package mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.450

0.550

0.600

0.0177

0.0217

0.0236

0.000

0.020

0.050

0.0000

0.0008

0.0020

b(2)

0.200

0.250

0.300

0.0079

0.0098

0.0118

1.900

2.000

2.100

0.0748

0.0787

0.0827

1.200

1.600

0.0472

0.0630

2.900

3.000

3.100

0.1142

0.1181

0.1220

1.200

1.600

0.0472

0.0630

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