HD3SS214

www.ti.com

SLAS907 – DECEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

–0.5

4

V

Differential I/O

–0.5

4

Voltage range

V

Control pin

–0.5

Continuous power dissipation

See Thermal Information

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions

is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-B

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Supply voltage

3

3.3

3.6

V

Control Pins, Signal Pins

Input high voltage

2

V

(Dx_SEL, AUX_SEL, MODE, OE)

Input mid level voltage

AUX_SEL Pin

V

mV

mV

Control Pins, Signal Pins

Input low voltage

-0.1

0.8

V

(Dx_SEL, AUX_SEL, MODE, OE)

Differential voltage (Dx, AUXx)

Switch I/O diff voltage

0

1.8

Vpp

Dx switching I/O Common mode voltage

0

2

V

Switch I/O common mode voltage

AUXx (1) switching I/O Common mode

0

3.6

voltage

HD3SS214

0

70

°C

Operating free-air temperature

HD3SS214I

–40

105

°C

6.4 Thermal Information

HD3SS214

ZQE (µBGA)

UNIT

50 PINS

Junction-to-ambient thermal resistance

90.5

°C/W

Junction-to-case (top) thermal resistance

41.9

°C/W

Junction-to-board thermal resistance

53.9

°C/W

Junction-to-top characterization parameter

1.8

°C/W

Junction-to-board characterization parameter

53.4

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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