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M24C32-DRMF3TP Arkusz danych(PDF) 35 Page - STMicroelectronics |
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M24C32-DRMF3TP Arkusz danych(HTML) 35 Page - STMicroelectronics |
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35 / 40 page ![]() DocID023377 Rev 6 35/40 M24C32-A125 Package mechanical data 39 Figure 15. WFDFPN8 (MLP8) – 8-lead thin fine pitch dual flat package no lead 2 x 3 mm, package outline 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating (not connected) in the end application |
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