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STP3NK50Z Arkusz danych(PDF) 5 Page - STMicroelectronics

Numer części STP3NK50Z
Szczegółowy opis  Gate charge minimized
PDF  14 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STP3NK50Z Arkusz danych(HTML) 5 Page - STMicroelectronics

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STP3NK50Z
Electrical characteristics
14
The built-in back-to-back Zener diodes have been specifically designed to enhance not only
the device’s ESD capability, but also to make them capable of safely absorbing any voltage
transients that may occasionally be applied from gate to source. In this respect, the Zener
voltage is appropriate to achieve efficient and cost-effective protection of device integrity.
The integrated Zener diodes thus eliminate the need for external components.
Table 7. Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain current
-
2.3
A
ISDM
(1)
1.
Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
Source-drain current (pulsed)
-
9.2
A
VSD
(2)
2.
Pulse width limited by safe operating area
Forward on voltage
ISD= 2.3 A, VGS=0
-
1.6
V
trr
Reverse recovery time
ISD= 2.3 A, VDD= 40 V
di/dt = 100 A/µs,
(see Figure 17)
-
250
ns
Qrr
Reverse recovery charge
-
745
nC
IRRM
Reverse recovery current
-
6
A
trr
Reverse recovery time
ISD= 12 A,VDD= 40 V
di/dt=100 A/µs,
Tj=150 °C
(see Figure 17)
-
300
ns
Qrr
Reverse recovery charge
-
960
nC
IRRM
Reverse recovery current
-
6.2
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min
Typ.
Max.
Unit
V(BR)GSO Gate-source breakdown voltage IGS = ± 1mA, ID=0
30
-
-
V



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