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UT64BS1X433CPC Arkusz danych(PDF) 18 Page - Aeroflex Circuit Technology |
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UT64BS1X433CPC Arkusz danych(HTML) 18 Page - Aeroflex Circuit Technology |
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18 / 20 page ![]() 18 ORDERING INFORMATION UT64BS1X433 Matrix-A Package Option Associated Lead Finish (Z) 400-CLGA (C) Gold (S) 400-CCGA (A) Hot Solder Dipped (C) 400-CBGA (A) Hot Solder Dipped Lead Finish: (A) = Hot Solder Dipped (C) = Gold Screening Level: (NOTE 1 & 2) (P) = Prototype flow (Temperature Range: 25oC only) (E) = HiRel flow (Temperature Range: -55oC to +125oC) Case Outline: (Z) = 400-Ceramic Land Grid Array (S) = 400-Ceramic Column Grid Array (C) = 400-Ceramic Ball Grid Array Device Type: (64BS1X433) = Matrix-A 64-Channel 1:4 Bus Switch UT ********* - * * * Notes: 1. Prototype Flow per Aeroflex Manufacturing Flows Document. Devices are tested at 25oC only. Radiation is neither tested nor guaranteed. 2. HiRel Flow per Aeroflex Manufacturing Flows Document. Radiation is neither tested nor guaranteed. 36-00-03-001 Aeroflex Microelectronics Solutions - HiRel |
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