MICROWAVE CORPORATION

9 - 95

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

9

HMC424LP3

0.5dB LSB GaAs MMIC 6-BIT DIGITAL

ATTENUATOR, DC - 13 GHz

v04.0604

Outline Drawing

NOTES:

1. MATERIAL PACKAGE BODY: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY

3. LEAD AND GROUND PADDLE PLATING: Sn/Pb SOLDER

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

6. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED

TO PCB RF GROUND.

9. REFER TO HITTITE APPLICATION NOTE SUGGESTED PCB

LAND PATTERN.

Absolute Maximum Ratings

Control Voltage (V1 to V6)

Vee - 0.5 Vdc

Bias Voltage (Vee)

-7.0 Vdc

Channel Temperature

150 °C

Thermal Resistance

140 °C/W

Storage Temperature

-65 to + 150 °C

Operating Temperature

-55 to +85 °C

RF Input Power (0.5 - 13.0 GHz)

+25 dBm