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DF3-2P-2C Arkusz danych(PDF) 2 Page - Hirose Electric |
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DF3-2P-2C Arkusz danych(HTML) 2 Page - Hirose Electric |
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2 / 12 page ![]() A265 1. Recommended Temperature Profile (SMT) 2. Recommended Manual Soldering Condition (SMT) 3. Recommended Screen Thickness (SMT) 4. Board Warpage (SMT) 5. Recommended Soldering Condition (DIP) 6. Cleaning Condition 7. Connection Condition Note1: Maximum twice action is allowed under the same condition. However, the interval between the first and second actions must be maintained at room temperature. Note2: The temperature indicates the board surface temperature on the connector lead area. Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds 0.15 to 0.2mm Based on both connector edges, 0.03mm max. in the connector center portion sFlow Condition with Automatic Soldering Tool. Soldering temperature: 250±5ç, Soldering time: Within 3 seconds sManual Soldering Condition. Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds Refer to the "Nylon Connector Use Hand book". Refer to the "Nylon Connector Use Hand book". BPrecautions BEmbossed Carrier Tape Dimensions Unit: mm Product Type Size Number of Contacts A B C D DF3/3D-*P-2H 2 to 4 5 to 7 8 to 12 13 to 15 24 32 44 56 ––– 28.4 40.4 52.4 11.5 14.2 20.2 26.2 24.4 32.4 44.4 56.4 |
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