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MB91F528 Arkusz danych(PDF) 236 Page - SPANSION |
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MB91F528 Arkusz danych(HTML) 236 Page - SPANSION |
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236 / 241 page ![]() D at aS h ee t 208-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 2.55 g Code (Reference) P-LFQFP208-28×28-0.50 208-pin plastic LQFP (FPT-208P-M06) (FPT-208P-M06) C 2003-2010 FUJITSU SEMICONDUCTOR LIMITED F208027S-c-3-5 Details of "A" part 0.25(.010) (Stand off) (.004±.002) 0.10±0.05 (.024±.006) 0.60±0.15 1.50 +0.20 –0.10 +.008 –.004 .059 0°~8° "A" 0.08(.003) (.006±.002) 0.145±0.055 INDEX 1 LEAD No. 52 53 104 105 156 157 208 0.50(.020) 0.08(.003) M (.009±.002) 0.22±0.05 28.00±0.10(1.102±.004)SQ 30.00±0.20(1.181±.008)SQ (Mounting height) * Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/ March 28, 2014, MB91F528_DS705-00016-1v0-E 233 CONFIDENTIAL |
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