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SA261 Arkusz danych(PDF) 2 Page - Diotec Semiconductor |
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SA261 Arkusz danych(HTML) 2 Page - Diotec Semiconductor |
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2 / 2 page ![]() 1) Valid, if mounted on P.C. board with 25 mm2 copper pads at each terminal Dieser Wert gilt bei Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad) an jedem Anschluß 2 SA 261 … SA 264 Characteristics Kennwerte Forward voltage – Durchlaßspannung T j = 25 /CI F = 2 A V F < 1.8 V Leakage current – Sperrstrom T j = 25 /CV R = VRRM I R < 5 :A T j = 100 /CV R = VRRM I R < 100 :A Reverse recovery time I F = 0.5 A through/über t rr < 500 ns Sperrverzug I R = 1 A to/auf IR = 0.25 A Thermal resistance junction to ambient air R thA < 40 K/W 1) Wärmewiderstand Sperrschicht – umgebende Luft Thermal resistance junction to terminal R thT < 15 K/W Wärmewiderstand Sperrschicht – Kontaktfläche |
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