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SM2000 Arkusz danych(PDF) 2 Page - Diotec Semiconductor |
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SM2000 Arkusz danych(HTML) 2 Page - Diotec Semiconductor |
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2 / 2 page ![]() 1) Mounted on P.C. board with 25 mm2 copper pads at each terminal Montage auf Leiterplatte mit 25 mm2 Kupferbelag (Lötpad) an jedem Anschluß 45 28.02.2002 SM 4001 … SM 4007 SM 513, SM 516, SM 518, SM 2000 Rating for fusing – Grenzlastintegral t < 10 ms T A = 25 /Ci2t8 A2s Peak forward pulse current t = 1ms T A = 85 /CI FSM 100 A Max. zulässiger Stromimpuls Operating junction temperature – Sperrschichttemperatur T j – 50...+175 /C Storage temperature – Lagerungstemperatur T S – 50...+175 /C Characteristics Kennwerte Forward voltage – Durchlaßspannung T j = 25 /CI F = 1 A V F < 1.1 V Leakage current – Sperrstrom T j = 25 /CV R = VRRM I R < 5 :A T j = 100 /CV R = VRRM I R < 50 :A Thermal resistance junction to ambient air R thA < 45 K/W 1) Wärmewiderstand Sperrschicht – umgebende Luft Thermal resistance junction to terminal R thT < 10 K/W Wärmewiderstand Sperrschicht – Kontaktfläche |
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